Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

Yu Hsien Chou; Yuh Sung; Keng Liang Ou; Yih Ming Liu; Ming Der Ger

doi:10.1149/1.2821024

Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

Yu Hsien Chou, Yuh Sung, Keng Liang Ou, Yih Ming Liu, Ming Der Ger

研究成果: 雜誌貢獻 › 文章 › 同行評審

8 引文斯高帕斯（Scopus）

摘要

The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.

原文	英語
期刊	Electrochemical and Solid-State Letters
卷	11
發行號	2
DOIs	https://doi.org/10.1149/1.2821024
出版狀態	已發佈 - 2008
對外發佈	是

ASJC Scopus subject areas

電化學
材料科學(全部)

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10.1149/1.2821024

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abstract = "The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.",

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AU - Chou, Yu Hsien

AU - Sung, Yuh

AU - Ou, Keng Liang

AU - Liu, Yih Ming

AU - Ger, Ming Der

PY - 2008

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N2 - The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.

AB - The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.

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Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

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