TY - JOUR
T1 - Resin flow characteristics of underfill process on flip chip encapsulation
AU - Shen, Y.K.
AU - Ju, C.M.
AU - Shie, Y.J.
AU - Chien, H.W.
PY - 2004
Y1 - 2004
N2 - Flip chip package is the most important technology in IC package for the necessary of scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. This paper indicates that the analysis for flow visualization of the solder ball and chip between numerical simulation and experiment. A finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented. The injection situation uses for one line injection, L line injection, U line injection and central point injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results show that the filling situation for numerical simulation is closer to experiment.
AB - Flip chip package is the most important technology in IC package for the necessary of scale, velocity and cost by the development of semiconductor technology and the innovation of computer product. This paper indicates that the analysis for flow visualization of the solder ball and chip between numerical simulation and experiment. A finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented. The injection situation uses for one line injection, L line injection, U line injection and central point injection location. The injection process uses for different parameters (mold temperature, injection temperature, injection pressure, injection time). The results show that the filling situation for numerical simulation is closer to experiment.
UR - https://www.scopus.com/record/display.uri?eid=2-s2.0-4744352026&origin=resultslist&sort=plf-f&src=s&st1=Resin+Flow+Characteristic+of+Underfill+Process+on+Flip+Chip+Encapsulation&st2=&sid=8bb7c6b82851b504ddb7aab873388f1a&sot=b&sdt=b&sl=88&s=TITLE-ABS-KEY%28Resin+Flow+Characteristic+of+Underfill+Process+on+Flip+Chip+Encapsulation%29&relpos=1&citeCnt=6&searchTerm=
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U2 - 10.1016/j.icheatmasstransfer.2004.08.005
DO - 10.1016/j.icheatmasstransfer.2004.08.005
M3 - Article
SN - 0735-1933
VL - 31
SP - 1075
EP - 1084
JO - International Communications in Heat and Mass Transfer
JF - International Communications in Heat and Mass Transfer
IS - 8
ER -