This study determines the replication property and surface roughness of microfeatures of a Nimould that combines electroforming and large area hot embossing. The metal mould first uses a4 in. silicon wafer to fabricate a master using the UV-LIGA method, and then applies thesputtering method to sputter the copper element as the seed layer on the surface of the master. The electroforming method is used to manufacture the Ni mould insert from the master with theseed layer. Finally, this study uses thin film of polymethyl methacrylate (PMMA) material toreplicate the microfeatures of Ni mould insert by large area hot embossing. This study shows thereplication properties and surface roughness of different microfeature shapes and sizes for the Nimould insert and moulded PMMA on large area hot embossing. Experimental results show theaverage error in height of the microfeature is 0-61 mm for the Ni mould insert and moulded PMMA. The average error in surface roughness of the microfeature is 1-63 nm for the Ni mould insert andmoulded PMMA. Experimental results show the good replication and surface roughness ofmoulded PMMA are replicated from the Ni mould insert by large area hot embossing.
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