TY - JOUR
T1 - Multi-dimensional data registration CMOS/MEMS integrated inkjet printhead
AU - Liou, Jian Chiun
AU - Tseng, Fan Gang
N1 - Funding Information:
Authors would like to thank the support from National Science Council, Taiwan , NSC96-2120-M-007-010 , and the Chip Implementation Center (CIC), TSMC, Taiwan, for organizing the chip fabrication.
PY - 2011/6
Y1 - 2011/6
N2 - This paper describes our work aimed at developing an integrated multi-dimensional thermal inkjet (TIJ) printhead with data registration CMOS de-multiplexer utilizing bulk micromachining technology (MEMS). In this experiment, we developed a new structural design for chips used in inkjet printheads. We designed a thermal inkjet device, whose dimensions could be adjusted to optimize drop generation performance. The energy conversion device and accompanying system were based on an integrated driver head with the performance of a high-frequency, picoliter drop inkjet. The inkjet featured a smart CMOS circuit including D Flip-Flops signal processes along with bi-directional data transfer and 12 V power amplifiers in a printhead chip. All of the jets of the printhead were controlled by very few input lines, a pulse shape (ENABLE), a data line (DATA), a bit shift clock (BIT SHIFT), a state clearing pulse, 5-volt supply for the logic devices, a higher voltage for energizing the heater resisters, and a ground line. The fabricated backside etching of the thermal inkjet (TIJ) printhead was measured by open pool and closed pool systems. The starting voltage was measured at 6.5 V, and its lifespan was 1.5 × 108.
AB - This paper describes our work aimed at developing an integrated multi-dimensional thermal inkjet (TIJ) printhead with data registration CMOS de-multiplexer utilizing bulk micromachining technology (MEMS). In this experiment, we developed a new structural design for chips used in inkjet printheads. We designed a thermal inkjet device, whose dimensions could be adjusted to optimize drop generation performance. The energy conversion device and accompanying system were based on an integrated driver head with the performance of a high-frequency, picoliter drop inkjet. The inkjet featured a smart CMOS circuit including D Flip-Flops signal processes along with bi-directional data transfer and 12 V power amplifiers in a printhead chip. All of the jets of the printhead were controlled by very few input lines, a pulse shape (ENABLE), a data line (DATA), a bit shift clock (BIT SHIFT), a state clearing pulse, 5-volt supply for the logic devices, a higher voltage for energizing the heater resisters, and a ground line. The fabricated backside etching of the thermal inkjet (TIJ) printhead was measured by open pool and closed pool systems. The starting voltage was measured at 6.5 V, and its lifespan was 1.5 × 108.
KW - Bubble jet
KW - Etching
KW - Inkjet
KW - MEMS
KW - Printhead
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U2 - 10.1016/j.mee.2010.11.052
DO - 10.1016/j.mee.2010.11.052
M3 - Article
AN - SCOPUS:79952449929
SN - 0167-9317
VL - 88
SP - 888
EP - 901
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 6
ER -