Multi-dimensional data registration CMOS/MEMS integrated inkjet printhead

Jian Chiun Liou, Fan Gang Tseng

研究成果: 雜誌貢獻文章同行評審

6 引文 斯高帕斯(Scopus)


This paper describes our work aimed at developing an integrated multi-dimensional thermal inkjet (TIJ) printhead with data registration CMOS de-multiplexer utilizing bulk micromachining technology (MEMS). In this experiment, we developed a new structural design for chips used in inkjet printheads. We designed a thermal inkjet device, whose dimensions could be adjusted to optimize drop generation performance. The energy conversion device and accompanying system were based on an integrated driver head with the performance of a high-frequency, picoliter drop inkjet. The inkjet featured a smart CMOS circuit including D Flip-Flops signal processes along with bi-directional data transfer and 12 V power amplifiers in a printhead chip. All of the jets of the printhead were controlled by very few input lines, a pulse shape (ENABLE), a data line (DATA), a bit shift clock (BIT SHIFT), a state clearing pulse, 5-volt supply for the logic devices, a higher voltage for energizing the heater resisters, and a ground line. The fabricated backside etching of the thermal inkjet (TIJ) printhead was measured by open pool and closed pool systems. The starting voltage was measured at 6.5 V, and its lifespan was 1.5 × 108.
頁(從 - 到)888-901
期刊Microelectronic Engineering
出版狀態已發佈 - 6月 2011

ASJC Scopus subject areas

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 電氣與電子工程


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