Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou; Wen De Lin

doi:10.1109/NEMS.2017.8017133

Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou, Wen De Lin

研究成果: 書貢獻/報告類型 › 會議貢獻

3 引文斯高帕斯（Scopus）

摘要

Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

原文	英語
主出版物標題	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	776-779
頁數	4
ISBN（電子）	9781509030590
DOIs	https://doi.org/10.1109/NEMS.2017.8017133
出版狀態	已發佈 - 8月 25 2017
對外發佈	是
事件	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, 美国持續時間: 4月 9 2017 → 4月 12 2017

會議

會議	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
國家/地區	美国
城市	Los Angeles
期間	4/9/17 → 4/12/17

ASJC Scopus subject areas

電氣與電子工程
機械工業
電子、光磁材料
儀器

存取文件

10.1109/NEMS.2017.8017133

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Link to publication in Scopus

引用此

Liou, JC & Lin, WD 2017, Micro-device array LED processes on CMOS/MEMS substrate. 於 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017., 8017133, Institute of Electrical and Electronics Engineers Inc., 頁 776-779, 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, 美国, 4/9/17. https://doi.org/10.1109/NEMS.2017.8017133

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title = "Micro-device array LED processes on CMOS/MEMS substrate",

abstract = "Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.",

keywords = "addressing, ASIC, CMOS/MEMS",

author = "Liou, {Jian Chiun} and Lin, {Wen De}",

year = "2017",

month = aug,

day = "25",

doi = "10.1109/NEMS.2017.8017133",

language = "English",

pages = "776--779",

booktitle = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 ; Conference date: 09-04-2017 Through 12-04-2017",

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TY - GEN

T1 - Micro-device array LED processes on CMOS/MEMS substrate

AU - Liou, Jian Chiun

AU - Lin, Wen De

PY - 2017/8/25

Y1 - 2017/8/25

N2 - Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

AB - Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

KW - addressing

KW - ASIC

KW - CMOS/MEMS

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UR - http://www.scopus.com/inward/citedby.url?scp=85030872782&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2017.8017133

DO - 10.1109/NEMS.2017.8017133

M3 - Conference contribution

AN - SCOPUS:85030872782

SP - 776

EP - 779

BT - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Y2 - 9 April 2017 through 12 April 2017

ER -

Micro-device array LED processes on CMOS/MEMS substrate

摘要

會議

ASJC Scopus subject areas

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其它文件與鏈接

指紋

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