Lower power supply thermal bubble printhead chip with MEMS technology increasing thermal energy effect

This paper describes the low power supply aimed to develop a thermal inkjet(TIJ) printhead by using bulk micromachining technology (MEMS). This experiment develops new structure designs of chip for inkjet printheads. A thermal inkjet device is designed, several of the dimensions may be adjusted just a few microns to change or optimize the drop generation performance. This energy conversion devices and systems based on Integrated Driver Head with The Performance of High-Frequency And Picoliter Drop Inkjet and structures. The TIJ process is akin to an internal combustion engine driven by an explosive phase change rather than an oxidation. In cooking, boiling is experienced as a process with an unpredictable beginning, following the lighting of the cooking flame. The boiling process is given its essential predictability in TIJ by using very great power densities to superheat the fluid far above its normal boiling temperature. Some of the waste heat can be carried away by silicon substrate. That is, the heater has excellent heat capacity. Deciding it to warm a few degrees by taking up waste heat at a location away from the heater region can significantly assist the heat management problem. For thermal inkjet printhead, the back side etching is used. The technology of microelectro-mechanical system to achieve a better thermal isolation structure and minimize conductive heat losses. Controling energy conversion is important. The fabricated back side etching thermal inkjet (TIJ) printhead is measured by open pool and close pool system. The measured begin voltage is 6.5 V, Life time is 9×10̂7.