摘要
Interaction of copper(I)-polypyrrole (PPy) complexes prepared by dissolving excess bulk Cu from PPy and leaving the Cu+ within PPy was investigated. The Cu-PPy interaction resulting from an electron transfer from the Cu atom to the PPy was determined from surface-enhanced Raman spectroscopy (SERS) and X-ray photoelectron spectroscopy (XPS) analyses. There is one Cu+ for circa 6 pyrrole monomers estimated from the difference of the charges of Cu deposition and dissolution, the dissolving curves of cyclic voltammetry (CV) voltammograms, and the XPS analysis.
原文 | 英語 |
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頁(從 - 到) | 233-239 |
頁數 | 7 |
期刊 | Thin Solid Films |
卷 | 339 |
發行號 | 1-2 |
DOIs | |
出版狀態 | 已發佈 - 1999 |
對外發佈 | 是 |
ASJC Scopus subject areas
- 電子、光磁材料
- 金屬和合金
- 材料化學
- 表面、塗料和薄膜
- 表面和介面