TY - GEN
T1 - Fabricatiion of 3D microfluidic networks with a hybrid stamp
AU - Kung, Yu Chun
AU - Huang, Kuo Wei
AU - Yang, Y.
AU - Fan, Y. J.
AU - Chiou, Pei Yu
N1 - Copyright:
Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.
AB - We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.
UR - http://www.scopus.com/inward/record.url?scp=84875440175&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84875440175&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2013.6474393
DO - 10.1109/MEMSYS.2013.6474393
M3 - Conference contribution
AN - SCOPUS:84875440175
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 915
EP - 918
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -