Conductive Materials for Healing Wounds: Their Incorporation in Electroactive Wound Dressings, Characterization, and Perspectives

Chiranjeevi Korupalli, Hui Li, Nhien Nguyen, Fwu Long Mi, Yen Chang, Yu Jung Lin, Hsing Wen Sung

研究成果: 雜誌貢獻回顧型文獻同行評審

119 引文 斯高帕斯(Scopus)

指紋

深入研究「Conductive Materials for Healing Wounds: Their Incorporation in Electroactive Wound Dressings, Characterization, and Perspectives」主題。共同形成了獨特的指紋。

Engineering

Material Science