Circuitry of multiplexer-on-chip system within the micro-LED array manufacturing CMOS substrate

研究成果: 雜誌貢獻文章同行評審

9 引文 斯高帕斯(Scopus)

摘要

In this paper, this research is after the process CMOS driver substrate. It is the use of A Benzocyclobutene polymer thin films planarization coating material in elements of the LED array manufacturing process. This CMOS driver circuit is a mode architecture that uses serial input data and parallel output data. It is the use of shift registers and latch circuit cell to form the overall system chip. The current density of the microcrystalline LED elements of each size is the same condition. The current density of a single 16 μm microcrystalline LED pixel driven by a 2.85 V drive circuit board is about 2.69 μA.
原文英語
文章編號400
期刊Optical and Quantum Electronics
50
發行號11
DOIs
出版狀態已發佈 - 11月 1 2018

ASJC Scopus subject areas

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 電氣與電子工程

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