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查看斯高帕斯 (Scopus) 概要
施 永勳
主治醫師
,
臺北市立萬芳醫院
https://orcid.org/0000-0001-9241-5075
電子郵件
yunghsun
tmu.edu
tw
h-index
575
引文
11
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
1998 …
2024
每年研究成果
概覽
指紋
網路
研究成果
(28)
類似的個人檔案
(6)
指紋
查看啟用 Yung-Hsun Shih 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Material Science
Titanium
100%
Scanning Electron Microscopy
95%
Titanium Oxide
76%
Ultimate Tensile Strength
70%
Dental Composite
60%
Anodizing
59%
Dental Prosthesis
50%
Mechanical Strength
45%
Titanium Dioxide
42%
Finite Element Method
40%
Stainless Steel
40%
Carbide
40%
Lattice Constant
40%
Biocompatibility
38%
Transmission Electron Microscopy
35%
Oxide Compound
34%
Hydride
32%
Powder
27%
Oxidation Reaction
25%
Film
23%
Chemical Vapor Deposition
20%
Surface Analysis
20%
Oxide Film
20%
Diamond
20%
Debonding
20%
Nanocrystalline
20%
Fibrous Membrane
20%
Electrospinning
20%
Amorphous Material
20%
Compressive Strength
20%
Yield Stress
20%
Dynamic Loads
20%
Corrosion Resistance
20%
Tensile Testing
20%
Heat Treatment
20%
Analytical Method
20%
Electron Microscopy
20%
Biomedical Materials
20%
Diamond Films
16%
Nanocrystalline Material
16%
Finite Element Modeling
13%
Contact Angle
13%
Elastic Moduli
10%
Wettability
10%
Plastic Deformation
10%
Solder Joint
10%
Acoustic Emission Testing
10%
Nanoindentation
10%
Elastic Deformation
10%
Crystal Structure
10%
Engineering
Acoustic Emission
70%
Oxide Layer
50%
Ultimate Tensile Strength
43%
Finite Element Method
40%
Silanization
26%
Microstructure
25%
Laser Power
23%
Bonding System
20%
Bond Strength
20%
Set Cement
20%
Base Metal
20%
Hollow Fibre
20%
Ionomer Cement
20%
Oral Fluid
20%
Deformation Zone
20%
Optical Density
20%
Microwave Plasma
20%
Base Material
20%
Microstructural Characteristic
20%
Periodontal
20%
Stainless Steel
20%
Oxide Thickness
20%
Diamond
20%
Biomedical Application
20%
Natural Frequency
20%
Chemical Vapor Deposition
20%
Debonding
20%
Vapor Deposition
20%
Nanocrystalline
20%
Joints (Structural Components)
20%
Compressive Strength
20%
Electrospinning
20%
Frequency Analysis
20%
Mould Insert
20%
Microchannel
20%
Finite Element Modeling
18%
Resin Composite
16%
Plasma Treatment
15%
Tensile Test
13%
Substrate Distance
13%
Gas Pressure
13%
Spinneret
13%
Processing Parameter
13%
Acoustic Signal
13%
Electronic Scanning
12%
Statistically Significant Difference
11%
Mg Powder
10%
Repaired Specimen
10%
Repair Material
10%
Plastic Deformation
10%