Warpage phenomenon of thin-wall injection molding

Yuh Chyun Chiang, Hsin Chung Cheng, Chiung Fang Huang, Jeou Long Lee, Yi Lin, Yung Kang Shen

Research output: Contribution to journalArticlepeer-review

26 Citations (Scopus)


This study investigates warpage of electronic dictionary battery covers fabricated using thin-wall injection molding as a replacement for conventional insert molding. The primary concern is the molding window in thin-wall injection molding for acrylonitrile-butadiene styrene (ABS) and polycarbonate (PC)+ABS plastics. Finally, the process parameters for thin-wall injection molding that eliminate warpage of electronic dictionary battery covers are identified. Experimental results demonstrate that the area of the molding window for ABS exceeds that for PC+ABS. Analysis of the molding window reveals that ABS is more appropriate than PC+ABS for battery covers. Low melt temperature, high injection speed, and high packing pressure eliminate battery cover warpage. Melt temperature is the most important process parameter for eliminating warpage when using both ABS and PC+ABS.

Original languageEnglish
Pages (from-to)517-526
Number of pages10
JournalInternational Journal of Advanced Manufacturing Technology
Issue number5-8
Publication statusPublished - Jul 2011


  • Molding window
  • Taguchi method
  • Thin-wall injection molding
  • Warpage

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering


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