Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

Yu Hsien Chou; Yuh Sung; Keng Liang Ou; Yih Ming Liu; Ming Der Ger

doi:10.1149/1.2821024

Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

Yu Hsien Chou, Yuh Sung, Keng Liang Ou, Yih Ming Liu, Ming Der Ger

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.

Original language	English
Journal	Electrochemical and Solid-State Letters
Volume	11
Issue number	2
DOIs	https://doi.org/10.1149/1.2821024
Publication status	Published - 2008
Externally published	Yes

ASJC Scopus subject areas

Electrochemistry
Materials Science(all)

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abstract = "The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.",

author = "Chou, {Yu Hsien} and Yuh Sung and Ou, {Keng Liang} and Liu, {Yih Ming} and Ger, {Ming Der}",

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T1 - Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

AU - Chou, Yu Hsien

AU - Sung, Yuh

AU - Ou, Keng Liang

AU - Liu, Yih Ming

AU - Ger, Ming Der

PY - 2008

Y1 - 2008

N2 - The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.

AB - The performance and thermal stability of the ultrathin nickel-molybdenum- phosphorus (Ni-Mo-P) barrier layer deposited by the nonisothermal deposition method in acid electroless bath have been clearly investigated. The as-deposited Ni-Mo-P film (15 nm) has a low resistivity, contains high amounts of Mo (6.7 atom %) and P (25 atom %), and has an amorphous structure. The barrier capability of this Ni-Mo-P film remains stable up to 650°C for 1 h annealing. This reveals that the resistance of Ni-Mo-P barrier film against Cu diffusion is very prominent, and this method for depositing Ni-Mo-P films is extremely promising for ultralarge-scale integration application.

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Ultrathin Ni-Mo-P diffusion barriers deposited using nonisothermal deposition method in acid bath

Abstract

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