Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant

C. Y. Hu; S. L. Lo; C. M. Li; W. H. Kuan

doi:10.1016/j.jhazmat.2004.12.038

Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant

C. Y. Hu, S. L. Lo, C. M. Li, W. H. Kuan

Research output: Contribution to journal › Article › peer-review

54 Citations (Scopus)

Abstract

The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.

Original language	English
Pages (from-to)	15-20
Number of pages	6
Journal	Journal of Hazardous Materials
Volume	120
Issue number	1-3
DOIs	https://doi.org/10.1016/j.jhazmat.2004.12.038
Publication status	Published - Apr 11 2005
Externally published	Yes

Keywords

Chemical mechanical polishing wastewater
Electro-coagulation- flotation process
Surfactant

ASJC Scopus subject areas

Pollution
Waste Management and Disposal
Health, Toxicology and Mutagenesis
Environmental Engineering
Environmental Chemistry

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10.1016/j.jhazmat.2004.12.038

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title = "Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant",

abstract = "The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.",

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AU - Hu, C. Y.

AU - Lo, S. L.

AU - Li, C. M.

AU - Kuan, W. H.

PY - 2005/4/11

Y1 - 2005/4/11

N2 - The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.

AB - The effect of surfactants on the treatment of chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation (ECF) process was studied. Two surfactants, cetyltrimethylammonium bromide (CTAB) and sodium dodecylsulfate (SDS) were employed in this study to compare the effect of cationic (CTAB) and anodic (SDS) surfactants on ECF. The cationic surfactant can enhance the removal of the turbidity, but anodic surfactant cannot. It can be explained by the hetero-coagulation theory. Moreover, the addition of CTAB in CMP wastewater can reduce the sludge volume and the flotation/sedimentation time in ECF process. The residual turbidity and dissolved silicon dropped with the increase of charge loading. No CTAB pollution problem exists after the ECF process.

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KW - Electro-coagulation- flotation process

KW - Surfactant

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Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation-flotation process with surfactant

Abstract

Keywords

ASJC Scopus subject areas

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