Silicon UTSi CMOS RFIC for CDMA wireless communications systems

Paul Rodgers; Mohamed Megahed; Chuck Page; John Wu; David Staab

Silicon UTSi CMOS RFIC for CDMA wireless communications systems

Paul Rodgers, Mohamed Megahed, Chuck Page, John Wu, David Staab

Research output: Contribution to journal › Conference article › peer-review

Abstract

Design and performance of UTSi CMOS down converter RFIC for CDMA applications is presented. The down converter consists of two-stage LNA, RF switch, and mixer integrated with passive matching components. Performance of building blocks have been evaluated. Results show that the stringent requirements for linearity at low power consumption required for CDMA can be achieved using UTSi CMOS technology. By integrating the down converter with PLL fabricated in the same process, it will be possible to realize a single chip transceiver IC. Results show that Silicon CMOS UTSi have the on-chip RF performance required for high level of integration of future wireless communication systems.

Original language	English
Pages (from-to)	485-488
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	2
Publication status	Published - Dec 1 1999
Externally published	Yes
Event	Proceedings of the 1999 IEEE MTT-S International Microwave Symposium Digest 'The Magic Touch of Microwaves' - Anaheim, CA, USA Duration: Jun 13 1999 → Jun 19 1999

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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title = "Silicon UTSi CMOS RFIC for CDMA wireless communications systems",

abstract = "Design and performance of UTSi CMOS down converter RFIC for CDMA applications is presented. The down converter consists of two-stage LNA, RF switch, and mixer integrated with passive matching components. Performance of building blocks have been evaluated. Results show that the stringent requirements for linearity at low power consumption required for CDMA can be achieved using UTSi CMOS technology. By integrating the down converter with PLL fabricated in the same process, it will be possible to realize a single chip transceiver IC. Results show that Silicon CMOS UTSi have the on-chip RF performance required for high level of integration of future wireless communication systems.",

author = "Paul Rodgers and Mohamed Megahed and Chuck Page and John Wu and David Staab",

year = "1999",

month = dec,

day = "1",

language = "English",

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journal = "IEEE MTT-S International Microwave Symposium Digest",

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note = "Proceedings of the 1999 IEEE MTT-S International Microwave Symposium Digest 'The Magic Touch of Microwaves' ; Conference date: 13-06-1999 Through 19-06-1999",

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T1 - Silicon UTSi CMOS RFIC for CDMA wireless communications systems

AU - Rodgers, Paul

AU - Megahed, Mohamed

AU - Page, Chuck

AU - Wu, John

AU - Staab, David

PY - 1999/12/1

Y1 - 1999/12/1

N2 - Design and performance of UTSi CMOS down converter RFIC for CDMA applications is presented. The down converter consists of two-stage LNA, RF switch, and mixer integrated with passive matching components. Performance of building blocks have been evaluated. Results show that the stringent requirements for linearity at low power consumption required for CDMA can be achieved using UTSi CMOS technology. By integrating the down converter with PLL fabricated in the same process, it will be possible to realize a single chip transceiver IC. Results show that Silicon CMOS UTSi have the on-chip RF performance required for high level of integration of future wireless communication systems.

AB - Design and performance of UTSi CMOS down converter RFIC for CDMA applications is presented. The down converter consists of two-stage LNA, RF switch, and mixer integrated with passive matching components. Performance of building blocks have been evaluated. Results show that the stringent requirements for linearity at low power consumption required for CDMA can be achieved using UTSi CMOS technology. By integrating the down converter with PLL fabricated in the same process, it will be possible to realize a single chip transceiver IC. Results show that Silicon CMOS UTSi have the on-chip RF performance required for high level of integration of future wireless communication systems.

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M3 - Conference article

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JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

T2 - Proceedings of the 1999 IEEE MTT-S International Microwave Symposium Digest 'The Magic Touch of Microwaves'

Y2 - 13 June 1999 through 19 June 1999

ER -

Silicon UTSi CMOS RFIC for CDMA wireless communications systems

Abstract

ASJC Scopus subject areas

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