Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper

Yu Chuan Liu; Thomas C. Chuang

doi:10.1021/jp0344996

Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper

Yu Chuan Liu, Thomas C. Chuang

Research output: Contribution to journal › Article › peer-review

48 Citations (Scopus)

Abstract

By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O₂ atmosphere at 30 °C for 60 days.

Original language	English
Pages (from-to)	9802-9807
Number of pages	6
Journal	Journal of Physical Chemistry B
Volume	107
Issue number	36
DOIs	https://doi.org/10.1021/jp0344996
Publication status	Published - Sept 11 2003
Externally published	Yes

ASJC Scopus subject areas

Materials Chemistry
Surfaces, Coatings and Films
Physical and Theoretical Chemistry

Access to Document

10.1021/jp0344996

Cite this

@article{ef719a57d85e4f7f97d07b7676a40036,

title = "Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper",

abstract = "By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O2 atmosphere at 30 °C for 60 days.",

author = "Liu, {Yu Chuan} and Chuang, {Thomas C.}",

year = "2003",

month = sep,

day = "11",

doi = "10.1021/jp0344996",

language = "English",

volume = "107",

pages = "9802--9807",

journal = "Journal of Physical Chemistry B",

issn = "1520-6106",

publisher = "American Chemical Society",

number = "36",

}

TY - JOUR

T1 - Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper

AU - Liu, Yu Chuan

AU - Chuang, Thomas C.

PY - 2003/9/11

Y1 - 2003/9/11

N2 - By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O2 atmosphere at 30 °C for 60 days.

AB - By combining techniques of underpotential deposition (UPD) and roughening metal substrates by a triangularwave oxidation-reduction cycle (ORC) which is generally used in surface-enhanced Raman scattering (SERS) studies, and extending applications of self-assembled monolayers (SAMs), copper is underpotentially deposited on electrochemically roughened Au(111) in this study for the first time. The formation of SAMs and further autopolymerization of pyrrole monomers are found on the UPD Cu-modified gold surfaces. The stability of SAMs is significantly improved due to the presence of UPD Cu. Furthermore, electropolymerized polypyrrole (PPy) on this UPD Cu-modified roughened Au demonstrates some distinguishing properties. These include higher conductivities, higher intensity, and better resolution on SERS and improved anti-aging ability in a 50% relative humility, 20% (v/v) O2 atmosphere at 30 °C for 60 days.

UR - http://www.scopus.com/inward/record.url?scp=0141937890&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0141937890&partnerID=8YFLogxK

U2 - 10.1021/jp0344996

DO - 10.1021/jp0344996

M3 - Article

AN - SCOPUS:0141937890

SN - 1520-6106

VL - 107

SP - 9802

EP - 9807

JO - Journal of Physical Chemistry B

JF - Journal of Physical Chemistry B

IS - 36

ER -

Self-Assembly and Autopolymerization of Pyrrole and Characteristics of Electrodeposition of Polypyrrole on Roughened Au(111) Modified by Underpotentially Deposited Copper

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this