Engineering & Materials Science
Nanocrystallization
94%
Plasmas
78%
Copper
69%
Oxygen
69%
Annealing
56%
Diodes
52%
Crystal microstructure
35%
Leakage currents
30%
Electric properties
30%
Transmission electron microscopy
29%
X ray diffraction
28%
Oxidation
25%
Substrates
20%
Physics & Astronomy
oxygen plasma
100%
copper
61%
junction diodes
56%
barrier layers
46%
p-n junctions
44%
performance
28%
annealing
25%
integrity
22%
leakage
17%
penetration
17%
grain size
16%
oxidation
15%
electrical properties
15%
transmission electron microscopy
14%
diffraction
11%
x rays
9%
Chemical Compounds
Nanocrystallization
88%
Plasma
53%
Dioxygen
41%
Liquid Film
41%
Amorphous Material
39%
Leakage Current
37%
Diffusion
35%
Grain Size
26%
Electrical Property
23%
Transmission Electron Microscopy
18%
X-Ray Diffraction
14%
Oxidation Reaction
12%
Surface
9%