Microfluidic chip fabrication using hot embossing and thermal bonding of cop

The application of silicon mold inserts by micro-hot embossing molding has been explored in microfluidic chip fabrication. For the mold insert, this study employed an SU-8 photoresist to coat the silicon wafer. Ultraviolet light was then used to expose the pattern on the SU-8 photoresist surface. This study replicates the microstructure of the silicon mold insert by micro-hot embossing molding. Different processing parameters (embossing temperature, embossing pressure, embossing time, and de-molding temperature) for the cycle-olefin polymer (COP) film of microfluidic chips are evaluated. The results showed that the most important parameter for replication of molded microfluidic chip is embossing temperature. De-molding temperature is the most important parameter for surface roughness of the molded microfluidic chip. The microchannel is bonded with a cover by thermal bonding processing to form the sealed microfluidic chip. The bonding temperature is the most important factor in the bonding strength of the sealed microfluidic chip.