@inproceedings{75299049a8cb4983b91b45608f41d2fb,
title = "Microfluidic chip fabrication for silicon mold insert by micro hot embossing",
abstract = "This study uses the microfluidic chip as an example to discuss its properties using silicon mold insert by micro hot embossing molding. This study uses the lithography technology to fabricate the silicon mold insert. In this study, the authors use the Taguchi method (L9 table) to discuss the different processing parameters for the properties of molded microfluidic chip. The results show that the most important parameter is the embossing temperature for replication properties of molded microfluidic chip and the de-molding temperature is most important parameter for surface roughness for molded microfluidic chip.",
author = "Shih, {Yung Hsun} and Shen, {Yung Kang} and Yi Lin and Lee, {Jeou Long} and Lin, {Chon Ta} and Lee, {Chien Pang} and Wu, {Ming Wei}",
year = "2008",
doi = "10.1109/NEMS.2008.4484423",
language = "English",
isbn = "9781424419081",
series = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS",
pages = "690--693",
booktitle = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008",
note = "3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 ; Conference date: 06-01-2008 Through 09-01-2008",
}