@inproceedings{85b81d2e81ae4bea9fac988caf93c2bd,
title = "Micro-device array LED processes on CMOS/MEMS substrate",
abstract = "Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.",
keywords = "addressing, ASIC, CMOS/MEMS",
author = "Liou, \{Jian Chiun\} and Lin, \{Wen De\}",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 ; Conference date: 09-04-2017 Through 12-04-2017",
year = "2017",
month = aug,
day = "25",
doi = "10.1109/NEMS.2017.8017133",
language = "English",
series = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "776--779",
booktitle = "2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017",
}