Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou; Wen De Lin

doi:10.1109/NEMS.2017.8017133

Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou, Wen De Lin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

Original language	English
Title of host publication	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	776-779
Number of pages	4
ISBN (Electronic)	9781509030590
DOIs	https://doi.org/10.1109/NEMS.2017.8017133
Publication status	Published - Aug 25 2017
Externally published	Yes
Event	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States Duration: Apr 9 2017 → Apr 12 2017

Publication series

Name	2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017

Conference

Conference	12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Country/Territory	United States
City	Los Angeles
Period	4/9/17 → 4/12/17

Keywords

addressing
ASIC
CMOS/MEMS

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering
Electronic, Optical and Magnetic Materials
Instrumentation

Access to Document

10.1109/NEMS.2017.8017133

Cite this

Liou, J. C., & Lin, W. D. (2017). Micro-device array LED processes on CMOS/MEMS substrate. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 (pp. 776-779). Article 8017133 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2017.8017133

Micro-device array LED processes on CMOS/MEMS substrate. / Liou, Jian Chiun; Lin, Wen De.
2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 776-779 8017133 (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Liou, JC & Lin, WD 2017, Micro-device array LED processes on CMOS/MEMS substrate. in 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017., 8017133, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Institute of Electrical and Electronics Engineers Inc., pp. 776-779, 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017, Los Angeles, United States, 4/9/17. https://doi.org/10.1109/NEMS.2017.8017133

Liou JC, Lin WD. Micro-device array LED processes on CMOS/MEMS substrate. In 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 776-779. 8017133. (2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017). doi: 10.1109/NEMS.2017.8017133

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abstract = "Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.",

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Micro-device array LED processes on CMOS/MEMS substrate

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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