Micro-device array LED processes on CMOS/MEMS substrate

Jian Chiun Liou, Wen De Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.

Original languageEnglish
Title of host publication2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages776-779
Number of pages4
ISBN (Electronic)9781509030590
DOIs
Publication statusPublished - Aug 25 2017
Externally publishedYes
Event12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States
Duration: Apr 9 2017Apr 12 2017

Conference

Conference12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Country/TerritoryUnited States
CityLos Angeles
Period4/9/174/12/17

Keywords

  • addressing
  • ASIC
  • CMOS/MEMS

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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