Abstract
Special chip designed and fabrication micro-device array LED in panel systems. It is transferred signals onto micro-LED slides. Addressed device structure chosen LED die, which is the principle of the use of bonding technology to LED fabric placed on a CMOS/MEMS substrate, followed by micro-LED array of each style. Special chip design signals generation way is in a short time. It is a great thrust to launch the point light to form display. Specimen of panel through a special chip design (ASIC) to drive micro-LED array sequencing system technology. With the ASIC architecture circuit of the micro-LED system, it can drive 432 light points only 85μsec.
Original language | English |
---|---|
Title of host publication | 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 776-779 |
Number of pages | 4 |
ISBN (Electronic) | 9781509030590 |
DOIs | |
Publication status | Published - Aug 25 2017 |
Externally published | Yes |
Event | 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 - Los Angeles, United States Duration: Apr 9 2017 → Apr 12 2017 |
Conference
Conference | 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017 |
---|---|
Country/Territory | United States |
City | Los Angeles |
Period | 4/9/17 → 4/12/17 |
Keywords
- addressing
- ASIC
- CMOS/MEMS
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
- Electronic, Optical and Magnetic Materials
- Instrumentation