Investigations of adhesion between waveguide and InP-laser with finger structure bonding

Jian Chiun Liou

doi:10.1016/j.commatsci.2016.04.017

Investigations of adhesion between waveguide and InP-laser with finger structure bonding

Jian Chiun Liou

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

In this study, we focused on benzocyclobutene (BCB) coatings, finger structure bonding, and adhesion observation. To investigate a microdisk laser operating at a wavelength of 1310 nm, a system involving the use of 2 mm × 2 mm InP laser chips (bonded using divinyl siloxane-BCB through 2 cm × 2 cm hybrid laser processes), silicon-on-insulator wafer waveguides, a processing approach, and investigations based on chip architecture photographs was used. The I-V curve measured under the needle showed the feasibility of laser operation at a current of approximately 30 mA at 1.5 V. The maximum optical power was approximately 2.2 μW at 40 mA.

Original language	English
Pages (from-to)	30-37
Number of pages	8
Journal	Computational Materials Science
Volume	122
DOIs	https://doi.org/10.1016/j.commatsci.2016.04.017
Publication status	Published - Sept 1 2016
Externally published	Yes

ASJC Scopus subject areas

General Computer Science
General Chemistry
General Materials Science
Mechanics of Materials
General Physics and Astronomy
Computational Mathematics

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10.1016/j.commatsci.2016.04.017

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title = "Investigations of adhesion between waveguide and InP-laser with finger structure bonding",

abstract = "In this study, we focused on benzocyclobutene (BCB) coatings, finger structure bonding, and adhesion observation. To investigate a microdisk laser operating at a wavelength of 1310 nm, a system involving the use of 2 mm × 2 mm InP laser chips (bonded using divinyl siloxane-BCB through 2 cm × 2 cm hybrid laser processes), silicon-on-insulator wafer waveguides, a processing approach, and investigations based on chip architecture photographs was used. The I-V curve measured under the needle showed the feasibility of laser operation at a current of approximately 30 mA at 1.5 V. The maximum optical power was approximately 2.2 μW at 40 mA.",

author = "Liou, {Jian Chiun}",

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AB - In this study, we focused on benzocyclobutene (BCB) coatings, finger structure bonding, and adhesion observation. To investigate a microdisk laser operating at a wavelength of 1310 nm, a system involving the use of 2 mm × 2 mm InP laser chips (bonded using divinyl siloxane-BCB through 2 cm × 2 cm hybrid laser processes), silicon-on-insulator wafer waveguides, a processing approach, and investigations based on chip architecture photographs was used. The I-V curve measured under the needle showed the feasibility of laser operation at a current of approximately 30 mA at 1.5 V. The maximum optical power was approximately 2.2 μW at 40 mA.

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JO - Computational Materials Science

JF - Computational Materials Science

ER -

Investigations of adhesion between waveguide and InP-laser with finger structure bonding

Abstract

ASJC Scopus subject areas

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