TY - GEN
T1 - Integrated Multi-Level CMOS Electrostatic Discharge (MLC-ESD) Protection Medical Ultrasound Chip System
AU - Liou, Jian Chiun
AU - Lin, Wen De
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/12/22
Y1 - 2016/12/22
N2 - This paper describes the advantages of integrating a common Power Clamp with the ability to withstand voltage and save on wafer area. The system chip does not require a power clamp for each input source. It is as long as the system core circuit by electrostatic protection. It can reach normal operation and save as much chip area as possible. The structure of this paper has three main features: (1) electrostatic protection (ESD) circuit common Power Clamp combination (2) T025 process high and low voltage ESD (3) The experiment and results within ESD system. The results of ESD sensitivity passed is-6250V~+6200V for type HBM mode. It is-375V~+375V for type MM mode.
AB - This paper describes the advantages of integrating a common Power Clamp with the ability to withstand voltage and save on wafer area. The system chip does not require a power clamp for each input source. It is as long as the system core circuit by electrostatic protection. It can reach normal operation and save as much chip area as possible. The structure of this paper has three main features: (1) electrostatic protection (ESD) circuit common Power Clamp combination (2) T025 process high and low voltage ESD (3) The experiment and results within ESD system. The results of ESD sensitivity passed is-6250V~+6200V for type HBM mode. It is-375V~+375V for type MM mode.
KW - CMOS
KW - ESD
UR - http://www.scopus.com/inward/record.url?scp=85011028273&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85011028273&partnerID=8YFLogxK
U2 - 10.1109/GTSD.2016.28
DO - 10.1109/GTSD.2016.28
M3 - Conference contribution
AN - SCOPUS:85011028273
T3 - Proceedings - 3rd International Conference on Green Technology and Sustainable Development, GTSD 2016
SP - 78
EP - 81
BT - Proceedings - 3rd International Conference on Green Technology and Sustainable Development, GTSD 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Green Technology and Sustainable Development, GTSD 2016
Y2 - 24 November 2016 through 25 November 2016
ER -