Engineering & Materials Science
Chemical vapor deposition
100%
Plasmas
45%
Chlorine
45%
Nitridation
38%
Thermodynamic stability
37%
Transmission electron microscopy
37%
Thin films
34%
Copper
29%
Titanium
23%
Amorphous films
19%
Hydrogen
19%
Diffusion barriers
18%
Plasma enhanced chemical vapor deposition
17%
Sheet resistance
16%
Microstructure
16%
Electric Conductivity
13%
X ray diffraction
12%
Multilayers
11%
Nitrogen
11%
Ions
11%
Vapors
10%
Textures
9%
Silicon
9%
Substrates
8%
Metals
7%
Chemical Compounds
Resistance
54%
Diffusion
52%
Liquid Film
41%
Plasma
38%
Chlorine
32%
Thermal Stability
24%
Transmission Electron Microscopy
24%
Microstructure
16%
Diffusion Barrier
15%
Sheet Resistance
14%
Deposition Technique
13%
Hydrogen
12%
Crystalline Texture
11%
Electrical Conductivity
9%
Nitrogen
7%
X-Ray Diffraction
6%
Ion
4%
Physics & Astronomy
vapor deposition
65%
chlorine
39%
thermal stability
32%
copper
26%
transmission electron microscopy
24%
titanium
20%
thin films
18%
stability tests
17%
hydrogen
15%
microstructure
14%
laminates
11%
performance
10%
textures
10%
vapors
9%
nitrogen
8%
electrical resistivity
7%
silicon
6%
diffraction
6%
metals
6%
ions
5%
x rays
5%