TY - GEN
T1 - Fabrication of micropattern of plastic film using ultrasonic micro embossing
AU - Cheng, Hsin Chung
AU - Huang, Chiung Fang
AU - Lin, Yi
AU - Shen, Yung Kang
PY - 2014
Y1 - 2014
N2 - This study indicates the micropattern of molded plastic film from a mold insert using ultrasonic micro embossing. A mold insert and plastic film are heated above the glass transition temperature of plastic, and the softened plastic is flowed into the micropattern of a mold insert by applying pressure via a conventional technique. A longitudinal ultrasonic wave is added to the ultrasonic micro embossing process. The longitudinal ultrasonic wave generated by an ultrasonic system at a frequency of 35 KHz, has amplitude of 20 μm and output power of 900 W. The micropatterns of the Ni mold insert are groove-shaped and they are 2-μm wide and 200-nm deep. The Polypropylene (PP) is chosen as the replication materials. This study identifies the replication properties of the plastic film using different process parameters (working pressure, ultrasonic pressure, packing pressure, working time, ultrasonic time and packing time). Results of this study demonstrate that ultrasonic time is the most important process parameter for ultrasonic micro embossing.
AB - This study indicates the micropattern of molded plastic film from a mold insert using ultrasonic micro embossing. A mold insert and plastic film are heated above the glass transition temperature of plastic, and the softened plastic is flowed into the micropattern of a mold insert by applying pressure via a conventional technique. A longitudinal ultrasonic wave is added to the ultrasonic micro embossing process. The longitudinal ultrasonic wave generated by an ultrasonic system at a frequency of 35 KHz, has amplitude of 20 μm and output power of 900 W. The micropatterns of the Ni mold insert are groove-shaped and they are 2-μm wide and 200-nm deep. The Polypropylene (PP) is chosen as the replication materials. This study identifies the replication properties of the plastic film using different process parameters (working pressure, ultrasonic pressure, packing pressure, working time, ultrasonic time and packing time). Results of this study demonstrate that ultrasonic time is the most important process parameter for ultrasonic micro embossing.
KW - Micropattern
KW - Process parameter
KW - Replication
KW - Ultrasonic micro embossing
UR - http://www.scopus.com/inward/record.url?scp=84901269313&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84901269313&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.912-914.141
DO - 10.4028/www.scientific.net/AMR.912-914.141
M3 - Conference contribution
AN - SCOPUS:84901269313
SN - 9783038350774
T3 - Advanced Materials Research
SP - 141
EP - 144
BT - Frontiers of Advanced Materials and Engineering Technology II
PB - Trans Tech Publications
T2 - 2014 International Conference on Frontiers of Advanced Materials and Engineering Technology, FAMET 2014
Y2 - 28 March 2014 through 29 March 2014
ER -