Fabricatiion of 3D microfluidic networks with a hybrid stamp

Yu Chun Kung; Kuo Wei Huang; Y. Yang; Y. J. Fan; Pei Yu Chiou

doi:10.1109/MEMSYS.2013.6474393

Fabricatiion of 3D microfluidic networks with a hybrid stamp

Yu Chun Kung, Kuo Wei Huang, Y. Yang, Y. J. Fan, Pei Yu Chiou

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.

Original language	English
Title of host publication	IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages	915-918
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2013.6474393
Publication status	Published - 2013
Externally published	Yes
Event	IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan Duration: Jan 20 2013 → Jan 24 2013

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Country/Territory	Taiwan
City	Taipei
Period	1/20/13 → 1/24/13

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMSYS.2013.6474393

Cite this

Kung, Y. C., Huang, K. W., Yang, Y., Fan, Y. J., & Chiou, P. Y. (2013). Fabricatiion of 3D microfluidic networks with a hybrid stamp. In IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 (pp. 915-918). Article 6474393 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2013.6474393

Fabricatiion of 3D microfluidic networks with a hybrid stamp. / Kung, Yu Chun; Huang, Kuo Wei; Yang, Y. et al.
IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013. 2013. p. 915-918 6474393 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kung, YC, Huang, KW, Yang, Y, Fan, YJ & Chiou, PY 2013, Fabricatiion of 3D microfluidic networks with a hybrid stamp. in IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013., 6474393, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 915-918, IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013, Taipei, Taiwan, 1/20/13. https://doi.org/10.1109/MEMSYS.2013.6474393

@inproceedings{696c0c91928648cdb2681975eaa8aee8,

title = "Fabricatiion of 3D microfluidic networks with a hybrid stamp",

abstract = "We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.",

author = "Kung, {Yu Chun} and Huang, {Kuo Wei} and Y. Yang and Fan, {Y. J.} and Chiou, {Pei Yu}",

note = "Copyright: Copyright 2013 Elsevier B.V., All rights reserved.; IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 ; Conference date: 20-01-2013 Through 24-01-2013",

year = "2013",

doi = "10.1109/MEMSYS.2013.6474393",

language = "English",

isbn = "9781467356558",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "915--918",

booktitle = "IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013",

}

TY - GEN

T1 - Fabricatiion of 3D microfluidic networks with a hybrid stamp

AU - Kung, Yu Chun

AU - Huang, Kuo Wei

AU - Yang, Y.

AU - Fan, Y. J.

AU - Chiou, Pei Yu

PY - 2013

Y1 - 2013

N2 - We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.

AB - We report on a novel methodology for fabricating multilayer, high aspect ratio, 3D microfluidic structures with through-layer vias that can be bonded between two hard substrates. It is realized by using a plastic plate embedded PDMS stamp in soft lithography to obtain flat and open PDMS structures that can be stacked to form multiplayer 3D microfluidic networks in high yield without severe structure distortion. Our method also allows the control of the curvature of the channel sidewalls and the shape of channel cross section that may open up profound applications in electrokinetics, microoptics, and inertia microfluidics.

UR - http://www.scopus.com/inward/record.url?scp=84875440175&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84875440175&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2013.6474393

DO - 10.1109/MEMSYS.2013.6474393

M3 - Conference contribution

AN - SCOPUS:84875440175

SN - 9781467356558

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 915

EP - 918

BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013

T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013

Y2 - 20 January 2013 through 24 January 2013

ER -

Fabricatiion of 3D microfluidic networks with a hybrid stamp

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this