TY - JOUR
T1 - Comparison of resistive switching characteristics by using e-gun/sputter deposited SiOx film in W/SiOx/TiN structure and pH/creatinine sensing through iridium electrode
AU - Roy, Sourav
AU - Roy, Anisha
AU - Panja, Rajeswar
AU - Samanta, Subhranu
AU - Chakrabarti, Somsubhra
AU - Yu, Po Lin
AU - Maikap, Siddheswar
AU - Cheng, Hsin Ming
AU - Tsai, Ling Na
AU - Qiu, Jian Tai
N1 - Publisher Copyright:
© 2017 Elsevier B.V.
PY - 2017
Y1 - 2017
N2 - Effects of two deposition techniques like e-gun evaporation and RF sputtering for the SiOx films have been evaluated, and a long program/erase (P/E) endurance of >109 cycles with small pulse width of 100 ns and lower P/E current of <50 μA has been achieved for the e-gun deposited SiOx film in a simple W/SiOx/TiN structure for the first time. However, the RF sputtering deposited SiOx switching material has shown higher operation current of >200 μA. Resistive switching characteristics by using tungsten (W) and iridium (Ir) electrodes in a metal/SiOx/TiN structure have been also investigated. Memory device with amorphous SiOx film is observed by transmission electron microscope image. E-gun deposited films show more defective SiOx than the sputtering and the mixture of Si0 and Si4+ oxidation states are observed, which is confirmed by X-ray photoelectron spectroscopy. Schottky barrier height modulation is responsible for changing the high and low resistance states (0.55 eV vs, 0.46 eV) under external bias at low current of 10 μA. Similarly, the pH sensing occurs in Ir/SiOx/TiN structure due to Schottky barrier height changing at the Ir/SiOx interface. Under external bias, reduction-oxidation (redox) occurs at the SiOx/TiN interface for the W/SiOx/TiN structure and Ir/SiOx interface by changing of Si0/Si4+ oxidations states as well as Schottky barrier height is modulated owing to O2− ions migration. This switching mechanism is also understood by pH sensing. Creatinine with a low concentration of 100 nM has been detected through Ir electrode using Ir/SiOx/TiN structure for the first time, which will be useful for healthcare unit in near future.
AB - Effects of two deposition techniques like e-gun evaporation and RF sputtering for the SiOx films have been evaluated, and a long program/erase (P/E) endurance of >109 cycles with small pulse width of 100 ns and lower P/E current of <50 μA has been achieved for the e-gun deposited SiOx film in a simple W/SiOx/TiN structure for the first time. However, the RF sputtering deposited SiOx switching material has shown higher operation current of >200 μA. Resistive switching characteristics by using tungsten (W) and iridium (Ir) electrodes in a metal/SiOx/TiN structure have been also investigated. Memory device with amorphous SiOx film is observed by transmission electron microscope image. E-gun deposited films show more defective SiOx than the sputtering and the mixture of Si0 and Si4+ oxidation states are observed, which is confirmed by X-ray photoelectron spectroscopy. Schottky barrier height modulation is responsible for changing the high and low resistance states (0.55 eV vs, 0.46 eV) under external bias at low current of 10 μA. Similarly, the pH sensing occurs in Ir/SiOx/TiN structure due to Schottky barrier height changing at the Ir/SiOx interface. Under external bias, reduction-oxidation (redox) occurs at the SiOx/TiN interface for the W/SiOx/TiN structure and Ir/SiOx interface by changing of Si0/Si4+ oxidations states as well as Schottky barrier height is modulated owing to O2− ions migration. This switching mechanism is also understood by pH sensing. Creatinine with a low concentration of 100 nM has been detected through Ir electrode using Ir/SiOx/TiN structure for the first time, which will be useful for healthcare unit in near future.
KW - Creatinine detection
KW - pH sensing
KW - Resistive switching
KW - Si/Si oxidation state
KW - W/Ir electrode
UR - http://www.scopus.com/inward/record.url?scp=85026729006&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85026729006&partnerID=8YFLogxK
U2 - 10.1016/j.jallcom.2017.07.304
DO - 10.1016/j.jallcom.2017.07.304
M3 - Article
AN - SCOPUS:85026729006
SN - 0925-8388
VL - 726
SP - 30
EP - 40
JO - Journal of Alloys and Compounds
JF - Journal of Alloys and Compounds
ER -