Abstract
The 3C (Computer, Communication and Consumer) product has the properties of being light, thin, short and small. In this study, numerical simulations of three-dimensional injection molding are used for thin-walled product. The governing differential equations are discredited by using control volume finite element method. This research points out the processing phenomenon of electronic dictionary battery covers in thin-walled injection molding. This research emphasizes the gate design of thin-walled injection molding for PC+ABS materials. The results show that the gate for single point of two sides is suitable on thin-walled injection molding by numerical simulation. The results also show that the processing is very well for thin-walled injection molding by numerical simulation.
Original language | English |
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Pages (from-to) | 728-734 |
Number of pages | 7 |
Journal | International Communications in Heat and Mass Transfer |
Volume | 35 |
Issue number | 6 |
DOIs | |
Publication status | Published - Jul 2008 |
Keywords
- Gate design
- MoldFlow
- Numerical simulation
- Thin-walled product
ASJC Scopus subject areas
- Condensed Matter Physics
- General Chemical Engineering
- Atomic and Molecular Physics, and Optics