An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing

Engineering & Materials Science

• Actuators 30%
• Application specific integrated circuits 86%
• Clocks 34%
• Controllers 22%
• Data transfer 41%
• Electric potential 21%
• Flip flop circuits 47%
• Heating 29%
• Hot Temperature 39%
• Ink 44%
• Integrated circuit design 100%
• Logic devices 52%
• Micromechanics 50%
• Networks (circuits) 22%
• Nozzles 70%
• Power amplifiers 40%
• Printing 39%
• Signal processing 33%
• Temperature sensors 43%