Abstract
With the rapidly advancing semiconductor technology and competitive business conditions, it is very crucial to maintain high operation efficiency and maximize the key product throughput to supply market in a timely manner. Dynamic WIP (Work in Process) Dispatching is a new technology to efficiently dispatch semiconductor manufacturing materials to desired tools for lot process promptly in response to dynamically changing operational and business needs. This paper will describes how dynamic WIP dispatching capabilities are built on the next generation Manufacturing Execution System in Intel's manufacturing facilities, and employed in advanced 300mm factories to significantly reduce throughput times, inventory levels, and labor overhead.
| Original language | English |
|---|---|
| Article number | MC276 |
| Pages (from-to) | 39-42 |
| Number of pages | 4 |
| Journal | IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings |
| Publication status | Published - Dec 15 2005 |
| Externally published | Yes |
| Event | IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings - San Jose, CA, United States Duration: Sept 13 2005 → Sept 15 2005 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
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